Title:
Packaging of High Power Semiconductor Lasers by Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu.
Micro- and Opto-Electronic Materials, Structures, and Systems
Micro- and Opto-Electronic Materials, Structures, and Systems
Author:
Liu, Xingsheng. author.
Zhao, Wei. author.
Xiong, Lingling. author.
Liu, Hui. author.
SpringerLink (Online service)
General Notes:
Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging.
This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
Publisher:
Springer New York : Imprint: Springer,
Publication Place:
New York, NY :
ISBN:
9781461492634
Subject:
Energy.
Energy systems.
Energy.
Energy Systems.
Series:
Micro- and Opto-Electronic Materials, Structures, and Systems
Micro- and Opto-Electronic Materials, Structures, and Systems
Contents:
Introduction of High Power Semiconductor Lasers -- Overview of High Power Semiconductor Laser Packages -- Thermal Design and Management in High Power Semiconductor Laser Packaging -- Thermal Stress in High Power Semiconductor Lasers -- Optical Design and Beam Shaping in High Power Semiconductor Lasers -- Materials and Components in High Power Semiconductor Laser Packaging -- Packaging Process of High Power Semiconductor Lasers -- Testing and Characterization of High Power Semiconductor Lasers -- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging -- Applications of High Power Semiconductor Lasers -- Development Trend and Challenges in High Power Semiconductor Laser Packaging.
Physical Description:
XV, 402 p. 497 illus., 386 illus. in color. online resource.
Electronic Location:
http://dx.doi.org/10.1007/978-1-4614-9263-4
Publication Date:
2015.
Log in
Help
