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Subject
Title
Title:
Wire bonding in microelectronics materials, processes, reliability, and yield / George G. Harmon.
Electronic packaging and interconnection series
Reliability and yield problems of wire bonding in microelectronics.
Electronic packaging and interconnection series.
Main Entry:
Harman, George G.
Harman, George G. Reliability and yield problems of wire bonding in microelectronics.
ebrary, Inc.
Publisher:
McGraw-Hill,
Publication Date:
c1997.
Publication Place:
New York :
ISBN:
0070326193 (recycled, acid-free paper)
Subject:
Wire bonding (Electronic packaging) -- Production control.
Electronic packaging -- Reliability.
Electronic packaging -- Defects.
Semiconductors -- Failures.
Electronic books.
Series:
Electronic packaging and interconnection series
Electronic packaging and interconnection series.
Edition:
2nd ed.
Cover Image:
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